小木虫 --- 500万硕博科研人员喜爱的学术科研平台
&&查看话题
【转贴】经典磨削书籍CRC出版社“Handbook of Machining with Grinding Wheels”
Taylor & Francis Group
6000 Broken Sound Parkway NW, Suite 300
Boca Raton, FL
& 2007 by Taylor & Francis Group, LLC
CRC Press is an imprint of Taylor & Francis Group, an Informa business
Grinding, once considered primarily a finishing operation involving low rates of removal, has evolved as a major competitor to cutting, as the term “abrasive machining” suggests. This is what Milton Shaw, the man who is considered the great pioneer and father of American grinding, said about 10 years ago. Shaw led the development of grinding in the United States over the last 50
making this probably the most complete book regarding all kinds of grinding operations. The aim of this book is to present a unified approach to machining with grinding wheels that will be useful in solving new grinding problems of the future. It should be of value to engineers and technicians involved in solving problems in industry and to those doing research on machining with grinding wheels in universities and research organizations.
The team of authors are famous researchers who have devoted their entire lives doing research in this field and who are still actively contributing to new research and development. The authors represent a large region of the world where abrasive machining with grinding wheels are most advanced: United States, Great Britain, Japan, and Germany. I thank my co-authors for taking time from their busy activities to write and review this book over a period of 2 years. All the co-authors are my long-time friends, and with some of them, I have previously published or we are still in the process of finishing other books. Here is a short presentation of them. Professor Brian Rowe is considered the world father of Centerless Grinding in addition to other notable research concerning grinding aspects: thermal and dynamic aspects, fluid-film bearings, etc. He established a great laboratory and school in manufacturing processes at Liverpool John Moores University. As an emeritus professor, Brian is busier than before retirement. As he is a
native English speaker, he spent a lot of time polishing our English in order to have a unitary book. I thank him for similar great work on our previous book, Tribology of Abrasive Machining Processes. Professor Ichiro Inasaki is the leading figure in Grinding in Japan. As dean of the Graduate
School of Science and Technology at Keio University, he developed a great laboratory with outstanding research activities. His “intelligent grinding wheel” is featured in the Noritake Museum and represents one of his best accomplishments and contributions. He led the International Institution
for Production Engineering Research in
as the president and was granted several awards including an SME award. Ichiro-san and I have written two books: Handbook of Ceramic Grinding and Polishing , and Tribology of Abrasive Machining Processes
Professor Eckart Uhlmann is professor and director of the Institute for Machine-Tools and Management at Technical University of Berlin. Dr. Uhlmann received this chaired professorship after a very successful industrial career with Hermes Abrasive in Germany. His main research is
on one of these transition processes: grinding with lapping kinematics. As the head of his institute, one of the largest in Germany, he holds the leading position in research on all aspects of abrasive machining with grinding wheels. A future book with Dr. Uhlmann will be also published this year,
Handbook of Lapping and Polishing/CMP
The Basic Process of Grinding..........................................................................................................1
Introduction...................................................................................................................3
1.1 From Craft to Science ..............................................................................................................3
1.2 Basic Uses of Grinding ............................................................................................................4
1.2.1 High Accuracy Required ..............................................................................................4
1.2.2 High Removal Rate Required ......................................................................................4
1.2.3 Machining of Hard Materials.......................................................................................4
1.3 Elements of the Grinding System ............................................................................................4
.........................
链接地址：/
研究生必备与500万研究生在线互动！
扫描下载送金币
浏览器进程
打开微信扫一扫
随时随地聊科研磨削加工中grinding, lapping, polishing 有什么区别？磨削加工中，grinding, lapping, polishing的字面上的翻译都是“研磨”，但实际上他们好像的精密磨削加工的三个不同的步骤？具体是怎么区别的呢？
grinding磨削lapping精研polishing抛光
应用于工件的切割(Cutting)、精磨(Grinding)、研磨(Lapping)和抛光(Polishing)它们只是一种精密机械，半导体加工设备，分单面和双面
为您推荐：
扫描下载二维码Content Not Found: Ingenta Connect
Content Not Found
Content Not Found
Unfortunately we are unable to locate the content you are looking for. It is possible
that the publisher, journal or issue is no longer hosted at Ingenta Connect, or that the link that
brought you to this page is incorrect.
Please use the
features to find the
content you are looking for.
Share Content
Access Key
Free content
New content
Open access content
Partial Open access content
Subscribed content
Free trial content
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in.114网址导航